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IC Tray

Product Detail Information

Products Overview

  • Raq and supplementary material for semiconductor packing
  • Protecting IC chips from electromagnetic wave, static electricity, external impacts and high temp, etc.

Product features

  • Type : TSOP,QFP(MQFP,LQFP,TQFP),BGA,CSP,BOC,MCP,LGA,ML(QFN),FLIP CJIP, etc.
  • Surface Resistance spec : 10E4~10E10
  • Tribo-charge spec : less than 100V
  • Bake temperature : 130'C, 150'C, 180'C, 260'C

 

Product Detail Image

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